Stellenbeschreibung

Summary In this new created position, the hired candidate will report directly to the Senior Director of R&D and will be responsible for leading three teams involved in the design of the electronic part of 3D ToF (Time of Flight) micro system: -Image Sensor design (11 people) -ASIC design (10 people) -Embedded Software (5 people) Client Details Our client is global player in the micro-optics market that serves intelligent micro systems to top tear smart devices vendors. The company employs over 1,000 people in Asia, Europe and Americas and has a competence center for R&D and Innovation based in Zurich with a team of 80 engineers, scientists and technicians. Description The main duties and responsibilities of the role are: -Supervise and coordinate specific modules development and/or wafer scale opto-electronic modules development with the internal Product Design Team, as well as coordinate external suppliers. -Participate in designing experiments at the R&D Lab related to these new products and support or assist in the testing of such components. This will involve electrical and optical testing and characterization. -Interacting with other technical teams in the company like Optical Design Engineering and R&D on existing and future designs and requirements. -Interacting with various external partner organizations. In some cases parts of design could be outsourced. -Operate as entry point of contact for customer product design request cooperating with Business Development and Product Management. Profile We are looking for a senior technical manager with development and production experience in semiconductor design and embedded software development used to work in a fast paced and demanding environment. We expect candidates with a Bachelor’s or Master’s Degree in Electrical Engineering, Electronics Engineering or similar qualification. The hired candidate shall be resourceful, hands-on, problem solver and have the capacity to quickly grasp and resolve a wide range of technical challenges. Requirements: -Minimum 2 to 5 years combined experience in managing similar sized teams in complex semiconductor product design. -In depth knowledge and understanding of semiconductor packaging and optical packaging processes. -Project management experience, the use of design of experiments (DOE), and root cause failure analysis. -Proven ability to solve complex analytical problems and provide robust solutions. -Team player with strong communication and interpersonal skills. -Independent and energetic personality with the ability to multitask. -Ability to travel both domestically and internationally. -Familiarity with electronics design CAD tools like Cadence, Mentor or Tanner. Preferred skills and expertise: -Process development and/or manufacturing experience for opto-electronics products would be a plus. -More than 3 years experience in a high-volume semiconductor environment. -Knowledge of semiconductor foundry processes is also a plus. Job Offer Leadership role in a fast paced and technology cutting edge environment.